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Kyocera Corporation (KYO)

2015-02-26@11:37:23 ET
Shares of Kyocera Receive a Boost, Up 2.2% (F77)

2015-02-26@10:12:47 ET
Global Photovoltaics (Organic PV, Inorganic PV) Market 2013-2020 (MTO)

2015-02-26@04:13:22 ET
Kyocera unveils miraie smartphone for children (DTM)

2015-02-25@23:33:28 ET
US Patent Issued to KYOCERA on Feb. 24 for "Acoustic wave device and method for producing same" (Japanese Inventor) (ABW)

2015-02-25@22:19:13 ET
US Patent Issued to Kyocera on Feb. 24 for "Electronic device, control method, and control program" (Japanese Inventor) (ABW)

2015-02-25@21:39:21 ET
US Patent Issued to Kyocera on Feb. 24 for "Cutting insert, cutting tool, and method of manufacturing machined product using the same" (Japanese Inventors) (ABW)

2015-02-25@21:34:29 ET
US Patent Issued to KYOCERA on Feb. 24 for "Wireless communication terminal and control method thereof" (Japanese Inventor) (ABW)

2015-02-25@02:04:37 ET
Flourishing small businesses buck the Welsh trend (ABW)

2015-02-24@22:22:01 ET
Kyocera CorporationCorporate Event Announcement Notice (WSH)

2015-02-23@21:00:47 ET
Kyocera CorporationCorporate Event Announcement Notice (WSH)

2015-02-20@17:36:20 ET
US Patent Issued to KYOCERA on Feb. 17 for "Radio communication system, high-power base station, low-power base station, radio terminal, and radio communication method" (Japanese Inventor) (ABW)

2015-02-20@17:25:33 ET
US Patent Issued to KYOCERA on Feb. 17 for "Communication method and base station apparatus" (Japanese Inventor) (ABW)

2015-02-20@16:56:20 ET
US Patent Issued to Kyocera on Feb. 17 for "Joined assembly, wafer holding assembly, attaching structure thereof and method for processing wafer" (Japanese Inventors) (ABW)

2015-02-16@11:02:19 ET
Kyocera unveils new TORQUE 4G LTE smartphone (DTM)

2015-02-12@23:54:07 ET
US Patent Issued to Kyocera on Feb. 10 for "Electronic device and electronic device control method" (Japanese Inventor) (ABW)

2015-02-12@23:40:55 ET
US Patent Issued to Kyocera on Feb. 10 for "Piezoelectric actuator, piezoelectric vibration apparatus and portable terminal having a region that is not flat for bonding to a flexible substrate" (Japanese Inventor) (ABW)

2015-02-12@23:36:26 ET
US Patent Issued to Kyocera on Feb. 10 for "Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same" (Japanese Inventors) (ABW)

2015-02-12@23:23:18 ET
US Patent Issued to Kyocera on Feb. 10 for "Thermal head and thermal printer provided with same" (Japanese Inventors) (ABW)

2015-02-12@22:32:09 ET
US Patent Issued to Kyocera on Feb. 10 for "Electronic device, screen control method, and storage medium storing screen control program" (Japanese Inventors) (ABW)

2015-02-12@21:37:39 ET
US Patent Issued to Kyocera on Feb. 3 for "Cutting tool" (Japanese Inventors) (ABW)