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Symbol:        VL Survey Page (2014-10-03)Premium Content



2014-10-31@00:34:17 ET
Inotera, Nanya shares up on Samsung leads (ABW)

2014-10-31@00:30:17 ET
TSMC says Sept sales up 35.1% yoy, hitting another record high (ABW)

2014-10-31@00:26:14 ET
Taiwan shares close up 1.76% (ABW)

2014-10-30@13:52:40 ET
Shares of Taiwan Semiconductor Manufacturing Under Pressure, Down 2.3% (F77)

2014-10-30@12:13:18 ET
Bearish Moving Average Cross by Taiwan Semiconductor Manufacturing (TSM) (F78)

2014-10-30@08:15:16 ET
Potential Taiwan Semiconductor Manufacturing (TSM) Trade Has 5.56% Downside Protection (FBM)

2014-10-29@15:17:48 ET
Potential Taiwan Semiconductor Manufacturing (TSM) Trade Targets 7.90% Return (FBM)

2014-10-28@10:59:42 ET
Taiwan Semiconductor Manufacturing (TSM) Showing Bullish Technicals With Support At $21.00 (FBM)

2014-10-28@08:40:00 ET
Earnings Releases, Court Rulings, and Preliminary Quarterly Results - Research Reports on TSMC, Seagate, 3DS, Xerox and Check Point (PRN)

2014-10-24@12:46:07 ET
Shares of Taiwan Semiconductor Manufacturing Under Pressure, Down 1.3% (F77)

2014-10-24@10:00:17 ET
Taiwan Semiconductor Manufacturing Fulfills the Promise: Up 2.8% Since Last Week's Upgrade (F70)

2014-10-24@09:53:45 ET
Taiwan Semiconductor Manufacturing In Retrospect: Shares Up 2.8% Since Upgraded One Week Ago (TSM) (F70)

2014-10-22@11:13:11 ET
US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "System and method for calibrating chips in a 3D chip stack architecture" (Taiwanese Inventors) (ABW)

2014-10-22@10:28:57 ET
US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "MIM decoupling capacitors under a contact pad" (Taiwanese Inventors) (ABW)

2014-10-22@10:14:18 ET
US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "Device and methods for forming partially self-aligned trenches" (Taiwanese Inventor) (ABW)

2014-10-22@10:07:26 ET
ADR Top % Movers (MID)

2014-10-22@09:29:21 ET
US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "Fully depleted SOI multiple threshold voltage application" (Taiwanese, American Inventors) (ABW)

2014-10-22@09:22:53 ET
US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "Method of forming post passivation interconnects" (Taiwanese Inventors) (ABW)

2014-10-22@09:12:59 ET
US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "FinFET design with LDD extensions" (Taiwanese Inventors) (ABW)

2014-10-22@08:21:37 ET
US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "Package systems having interposers with interconnection structures" (Taiwanese Inventors) (ABW)